PRODUCTS

BG Tape Remover

Catalogue (PDF) Download

  1. Ideal Tape Peeling
    An ideal 180-degree peeling technique is used when removing back grinding tape from the wafer. The technique minimizes stress to the wafer while the tape is removed, allowing the equipment to process thin wafers.
  2. Elimination of Damage to Wafer Circuit Surface
    Peeling tape is thermo-compression bonded to the BG Tape within 3mm from the wafer's periphery. This greatly reduces residual adhesive as well as damage to the wafer circuit surface usually caused by peeling tape lamination.
  3. Outstanding Cost Performance
    Peeling tape consumption does not vary with wafer size making for economical operation. Moreover, the peeling tape is of the thermo-compression type, ensuring secure lamination regardless of the presence of silicon dust on the back grinding tape.
  4. Automatic Control of UV Intensity and Quantity of Light
    The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light. This means a uniform level of UV intensity throughout the lamp's service life, ensuring stable tape removing even when using UV curable back grinding tape.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  • Barcode Reader for Selecting Recipes
Operation Process (RAD-3010F/12)
  1. Wafer Loading, Scanning, and Unloading
    Wafer scan sensor automatically detects the wafer storage conditions. A robotic arm with three-axis control transfers the wafer to the UV irradiation unit.
  2. UV Irradiation
    The wafer is uniformly irradiated with UV rays in the chamber, and transferred to the alignment unit by alignment conveyor.
  3. Wafer Alignment
    The wafer is aligned with reference to the orientation flat or V-notch, and then set by transfer arm onto the peeling table.
  4. BG Tape Removing
    Thermo-compression peeling tape is bonded by heat plate within 3mm from the wafer's periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle.
  5. Wafer Storage
    The removed back grinding tape and the peeling tape are placed into a dust box and the wafer is unloaded into a cassette by robotic arm.

Catalogue (PDF) Download

  1. Stress on the wafer during peeling is reduced with the new peeling method
    Using the latest heat seal peeling method, peeling tape is thermo-compression bonded to the back grinding tape within 3mm from the wafer's periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer. Having the new peeling method achieves a more stable peeling.
  2. Back grinding tape peeling is performed without any contact with the wafer backside
    By using our unique wafer holding table, back grinding tape removal is performed without any contact with the wafer backside.
  3. Adopts backside non-contact wafer handling method
    By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially shaped backside used in the manufacturing processes of power devices and TSV.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  • Compatible with clean room applications, and suitable for front-end process

Catalogue (PDF) Download

  1. Ideal Tape Peeling
    Applies the 180-degree tape peeling technique to remove back grinding tape from the wafer, minimizing stress on the wafer.
  2. Automatic Control of UV Intensity and Quantity of Light
    The equipment's built-in sensor provides feedback control to maintain constant UV intensity and quantity of light, which also enables stable peeling of UV curable back grinding tape.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)

Catalogue (PDF) Download

  1. Compactly Designed High Performance Remover
    Suitable for small-lot production in the assembly process as well as research and development. While capable of handling 300mm wafers, the equipment's compact design allows the effective use of workspace.
    *The equipment is compatible with both wafer and wafer mounted to ring frame.
  2. Easy-to-operate Semi-Automatic Type
    Once the wafer is set on the peeling table, the peeling tape can be laminated and the back grinding tape removed automatically with simple control inputs.
  3. Stable Removing of BG Tape
    Similar to the fully-automatic type, peeling tape is thermo-compression bonded to the BG Tape within 3mm from the wafer's periphery, and the back grinding tape is peeled from the wafer at a 180-degree angle. This minimizes the stress to the wafer, allowing the processing of large diameter, thin wafers.