PRODUCTS

UV Irradiation System

Catalogue (PDF) Download

  1. Compact, High-Throughput
    Handles wafers of both 300mm and 200mm. More compact with an integrated cassette loader and unloader. Provides high-throughput with two processing lines.
  2. High Quality and High Performance
    This is a sophisticated system developed by Lintec, the industry-leading supplier of UV curable dicing tapes. Supports the optimization of illuminance and light intensity with high output UV lamp and light intensity checking for each wafer process, and performs UV irradiation in an environment that prevents inhibition by oxygen*.
    *Conducts UV irradiation in a chamber filled with nitrogen to expel oxygen which inhibits UV curing.
  3. Smooth and Safe Operation
    A large touch panel improves operability. Ensures safety for operations and maintenance, complying with the SEMI safety guidelines, from design to assembly stages.
    * Supports CE marking
  4. Factory Automation of Assembly Process
    Realizes factory automation of total assembly process by integrating host communication function and inline system.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  • Barcode Reader for Selecting Recipes
  • Barcode Reader for Reading Ring Frame ID
  • Double Loader/Unloader
Operation Process (RAD-2010F/12)
  1. Work Loading, Scanning, and Unloading
    A work is automatically detected in the cassette, and then passed to the alignment unit.
  2. Irradiation Preparation
    The work is aligned, placed onto the lower pass line of the transfer arm, and then transferred to the UV irradiation starting position. The chamber is filled with nitrogen at this time.
  3. UV Irradiation
    The work in the chamber is moved above the UV lamp to be uniformly irradiated.
  4. Storage Preparation
    The UV-irradiated work is transferred along the upper pass line of the chamber and transfer arm, and then waits for being unloaded in the upper alignment position.
  5. Work Storage
    After the next work is loaded into the chamber, the processed work is stored in the cassette.

Catalogue (PDF) Download

  1. Fully-Automatic Improved Process Speed
    A fully-automatic system with integrated cassette loader and unloader increases operational efficiency.
  2. Controllable Illuminance and Light Intensity
    Allows control of illuminance and light intensity for effective UV irradiation with high output UV lamp.
  3. Uniform Irradiation of Entire Surface
    Employs method in which irradiation takes place during movement, achieving uniform irradiation of the entire surface.
  4. Self-diagnosis Function Supports Quality Control
    This is high performance system incorporates a self-diagnosis function that accurately detects irradiation errors.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  1. High Precision Irradiation with Constant Illuminance
    Square-wave lighting utilizing a high frequency inverter offers high precision, reliable UV irradiation with optimized illuminance and light intensity.
  2. Automatic Feedback Illuminance Control
    A built-in sensor enables feedback control to keep constant UV lighting output. By maintaining steady lighting throughout the lamp's life, the system contributes to fabrication of a constant quantity of semiconductors.
  3. Easy Operation with One Press of a Button
    Improves operability and stability with center loading, while significantly stepping up operational efficiency.
  4. Quick and Uniform Irradiation of Entire Surface
    Uniform irradiation of the entire surface is assured through mobilization of a nitrogen-filled chamber. Irradiation speed can be freely adjusted in accordance with conditions including wafer size and type.