PRODUCTS

Products for Dicing/Mounting Process

Wafer Mounter

RAD-2510F/12Sa(Video Clips)

Catalogue (PDF) Download

  1. Compatible with Ultra-thin Wafer
    A stand-alone system, and the ideal wafer multi-mounting system for ultra-thin wafer manufacture. From UV irradiation following the back grinding process, to alignment, mounting on dicing frames, and peeling of back grinding tape, all in a single machine.
  2. Wafer Handling Cycles Minimized
    The handling frequency of wafer is reduced to 4 times in stand-alone, and reduced to 2 times in in-line system. As a result, the damage to wafer is suppressed to the utmost limit.
  3. High Throughput
    High throughput achieved by optimizing the transfer component.
    * An increase in throughput of approximately 60% relative to RAD-2700F/12Sa (Throughput compared by the operation of 300mm bare wafer. Actual throughput varies with lamination and peeling conditions).
  4. Reduced Footprint
    Extremely compact in design, the equipment measures 2,165mm(W) x 3,090mm(D) x 1,800mm(H) (.not including the signal tower and protruding parts).
    * Compact design reduces equipment footprint by approximately 30% relative to RAD-2700F/12Sa.
  5. Dicing Tape with In-line Pre-cut System (Optional)
    Even if non pre-cut dicing tape is used, the optionally installed tape cutting mechanism with a unique inline pre-cut system will not damage the ring frame as the tape cutting is conducted inside the equipment.
  6. Heat Seal/Adhesion Peeling Tape Lamination
    For back grinding tape removal, both heat seal method and adhesive tape method (optional) can be used together in accordance with the physical properties of the back grinding tape used.
  7. Supports DBG Process (Optional)
    In addition to regular ring frame mounting with 300mm/200mm wafers and removing of back grinding tape, this mounter supports the DBG (Dicing Before Grinding) process, which is ideal for thin die fabrication.
  8. In-line Compatible with DISCO Corporation's DFG8000 series or DGP8000 series (Optional)
    By combining this mounter with the DISCO Corporation's DFG8000 series back grinder or DGP8000 series grinder/polisher, an in-line system with work space-capable of drastically reducing the risk of damage during the handling of thin wafers can be structured.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  • Vision System
  • Wafer Box Loading
    (Wafer ID Reader & Barcode Attachment System)
  • Dicing Tape In-line Pre-cutting
  • DBG Process Compatibility
  • In-line Operation with DISCO Corporation DFG8000 series or DGP8000 series
  • RFID Traceability System
Operation Process (RAD-2510F/125A)
  1. Wafer Loading, Scanning, and Unloading
    The load status of the wafer in the cassette is detected automatically, and the wafer is then retrieved by robotic arm and transferred to the alignment table (also functions as inspection table).
  2. Wafer Alignment
    The wafer is aligned by a CCD camera system with reference to the orientation flat or V-notch.
  3. UV Irradiation
    The wafer is transferred to the UV irradiation unit on the wafer delivery pad, where the back grinding tape is uniformly irradiated with UV, and then transferred to the mounting table.
  4. Frame Loading
    The frame piled up on the frame cassette is removed one by one and set on the mounting table.
  5. Tape Attachment
    Following UV irradiation, the wafer is set on the mounting table, and while the mounting table moves back and forth, pre-cut tape is attached to the wafer and frame with a press roller. A tape pre-cutting mechanism with a unique in-line batch cutting system may be installed as an option.
  6. BG Tape Peeling
    The back grinding tape of the wafer attached to the frame is peeled off. The tape is collected into the equipment's waste box.
  7. Wafer Storage
    The wafer attached to the frame is stored in the frame cassette.
  8. Wafer Control System (Optional)
    With this system, an ID number on the wafer is read, the data is then converted to barcode, and a label is attached. The wafer control system makes it possible to establish FA (factory automation) for the assembly process.

Catalogue (PDF) Download

  1. Built-in DAF Lamination Mechanism
    Standardly equipped with a DAF lamination mechanism, a high demand feature for stacked packages and other applications. This multi-function equipment is capable of handling UV irradiation on BG Tape DAF lamination, mounting to dicing frame, and back grinding tape removal.
  2. Reduced Footprint
    Extremely compact in design, the equipment measures
    2,200mm(W)x3,700mm(D)x1,800mm(H).
  3. Dicing Tape with In-line Pre-cut System (Optional)
    Even if non pre-cut dicing tape is used, the optionally installed tape cutting mechanism with a unique inline pre-cut system will not damage the ring frame as the tape cutting is conducted inside the equipment.
  4. Heat Seal/Adhesion Peeling Tape Lamination
    For back grinding tape removal, both heat seal format and adhesive tape format (optional) can be used together in accordance with the physical properties of the back grinding tape used.
  5. Supports DBG Process (Optional)
    In addition to regular ring frame mounting with 300mm/200mm wafers and removing of back grinding tape, this mounter supports the DBG (Dicing Before Grinding) process, which is ideal for thin chip fabrication.
  6. In-line Compatible with DISCO Corporation's DFG8000 series or DGP8000 series (Optional)
    By combining this mounter with the DISCO Corporation's DFG8000 series back grinder or DGP8000 series grinder/polisher, an in-line system with work space-capable of drastically reducing the risk of damage during the handling of thin wafers can be structured.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  • Vision System
    (Wafer ID Reader & Barcode Attachment system)
  • Dicing Tape In-line Pre-cutting
  • DBG Process Compatibility
  • In-line Operation with DISCO Corporation DFG8000 series or DGP8000 series
  • RFID Traceability System

Catalogue (PDF) Download

  1. Equipped with pre-cut tape vacuum mounting function
    High-precision wafer mounting is achieved for wafers with specially shaped backside that makes difficult to mount with the roller method.
  2. Performs tape mounting without contact with wafer surface
    By using our unique wafer holding table, wafer mounting is performed without contact with the wafer surface.
  3. Adopts backside non-contact wafer handling mechanism
    By adopting the non-contact wafer backside handling method, contamination caused by contact is eliminated for wafers with specially formed backside used in the manufacturing processes of power devices and TSV.
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  • Vision System
    (Wafer ID Reader & Barcode Attachment System)
  • Dicing Tape In-line Pre-cutting
  • RFID Traceability System

Catalogue (PDF) Download

  1. Industry's First Pre-cut Tape Handling Mounter
    Designed to conserve resources and improve productivity, the RAD-2500F/8 incorporates an abundance of know-how and utilizes a revolutionary pre-cut method.
  2. Proven Reliability
    Distributed worldwide, the repeat orders for RAD-2500F/8 are proof of the equipment's recognition for its outstanding reliability.
  3. High Speed Operation
    Max throughput is over 100 wafers per hour. While maintaining product quality, the equipment guarantees speedy and dependable work.
    *Can also be used for special mounting of package substrates (special specification).
Options
  • Host Communication Function
    (Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
  1. Semi-Automatic Mounting System for Pre-cut Tape
    Allows easy operation using pre-cut tapes. Simply set the wafer and frame to automatically apply dicing tapes.
  2. Safety Ensured for Manual Process
    With no cutter, the equipment is extremely safe. Elimination of the tape cutting process substantially increases efficiency.
  3. TTC* System for Accurate Tape Application
    The equipment's TTC system enables tape application with tape tension control, prevents air infiltration, and provides ideal tension for back-end process.
    *TTC (Tape Tension Control) System : The TTC is a cutting-edge system, in which a microcomputer controls tape tension. It enables the tape to be laminated according to the tape type and back-end processing conditions. On the fully-automatic type, tape application torque and torque curve can be set and registered with the equipment's touch screen.
  4. Reduced Footprint and High Performance
    High performance and yet compact, the equipment allows effective use of workspace and increases work efficiency.
    *Can also be used for special mounting of package substrates (special specification).
Options
  • Static Eliminator
  • Top Cover
  • Wafer Positioning Pins