LC Tape Laminator
LC Tape Backside Coating Process (Video Clips)
- LC Tape Laminator
An optimal system has been realized based on the concept of maximizing the property of the backside coating tape (LC Tape) used in flip chip packaging.
- High-precision tape lamination attained
By applying Lintec's unique lamination mechanism, high-precision tape lamination that prevents the formation of voids has been achieved.
- Internal tape pre-cutting mechanism
The internal tape pre-cutting mechanism cuts the tape to wafer size prior to lamination, preventing potential wafer edge damage caused by the cutter after lamination.
- Host Communication Function
(Communication Format: Conforms to SECS-I and HSMS/Software: Conforms to GEM)
- Double Cassette Loading
- Wafer ID Reader