Products for back-grinding process/DBG process
Our various products contribute to improve the workability and the stabilization of the quality in the back-grinding process of the semiconductor manufacturing process. We have provided the following products: BG Tape that protects the patterned surface of the wafer and Release Tape, BG Tape Laminator that automatically laminates the wafer with BG tape, BG Tape Remover that automatically peels the BG tape from the ground wafer.
BG Tape/Release Tape
There are two types of tapes that are the "E-series", UV curable tape and the "P-series", water flushable tape. The "E-series" tape is easy to remove from a wafer because the adhesive strength of the tape becomes weaker with UV irradiation. The "P-series" tape can remove particles by distilled water. We also provide "S-series", release tape.
About DBG process
The DBG (Dicing Before Grinding) process is a manufacturing process that grinds the backside of a wafer to make the wafer thin and dices a wafer to make chips at the same time. To inline from the grinding to transcribe diced chips reduces the damage risk of wafers so that enables to produce the ultra thin chips of 30-micron thickness stably.