Complete control of tape adhesion. The Lintec Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, and backside coating tapes. Adwill continues to make steady progress in the advancement of related devices and unique back-end processing systems.

Back-grinding & DBG proces

Dicing & Die Bonding process


Optical functional materials are indispensable for improving the functionality of diverse electronics materials, and for forming thin film layers. Currently, Lintec is applying its technological prowess in advanced material development and production towards the improvement of adhesive materials; the formulation and development of adhesives and coating materials that satisfy diverse performance requirements; the uniform composition and dispersion of the aforementioned; and precision thin film coating in extremely clean environments.