Complete control of tape adhesion. The Lintec Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, and backside coating tapes. Adwill continues to make steady progress in the advancement of related devices and unique back-end processing systems.
A variety of tapes are available including surface protection, dicing, chip back protection and clean room labels.
We offer a variety of equipment including tape laminators, tape removers, wafer mounters, UV irradiation devices and LC tape laminators.
We offer products that support various processes including backgrinding, dicing/mounting and pre-dicing.