Lintec of America will have a booth at the 2027 SEMICON WEST EXPO from March 30-April 1, 2027 at the Phoenix Convention Center, Phoenix, Arizona.
Equipment
- BG laminator
- DC laminator
- UV irradiation tool
- Semi-Automatic and Fully-Automatic
Tape
- Solvent resistant DC tape
- BG tape for bumped wafer
- BG tape for great TTV
- Low particle BG tape
- Heat resistant tape
- Back side coating tape (LC tape)
- Bump support film (BSF)
- DAF (LE tape)
Oregon office application center
- Introduction
If you will be attending 2027 SEMICON WEST, please visit LINTEC booth #3712. We look forward to seeing you.
Our reliable sales engineers will be happy to assist you on your next project.