LINTEC OF AMERICA will have a booth at the 22nd IMAPS Device Packaging Conference 2026 from March 2nd –5th, 2026 at The Sheraton Grand at Wild Horse Pass, Phoenix, AZ. Booth#: 411.
Equipment
- BG laminator
- DC laminator
- UV irradiation tool
- Semi-Automatic and Fully-Automatic
Tape
- Solvent resistant DC tape
- BG tape for bumped wafer
- BG tape for great TTV
- Low particle BG tape
- Heat resistant tape
- Back side coating tape (LC tape)
- Bump support film (BSF)
- DAF (LE tape)
Oregon office application center
- Introduction
If you will be attending IMAPS DPC, please visit the LINTEC of America booth. We look forward to seeing you.
Our reliable sales engineers will be happy to assist you on your next project.