Lintec of America will participate in the ECTC -The 2026 IEEE 76th Electronic Components and Technology Conference from May 26th – 29th at the JW Marriott & The Ritz-Carlton Grande Lakes Resort, Orlando, Florida.
LINTEC will explain various topics by Display and iPad in the booth.
Below are examples of introduction items.
Equipment
- BG laminator
- DC laminator
- UV irradiation tool
- Semi-Automatic and Fully-Automatic
Tape
- Solvent resistant DC tape
- BG tape for bumped wafer
- BG tape for great TTV
- Low particle BG tape
- Heat resistant tape
- Back side coating tape (LC tape)
- Bump support film (BSF)
- DAF (LE tape)
Oregon office application center
- Introduction
If you will be attending 2026 ECTC, please visit the LINTEC booth. We look forward to seeing you.
Our reliable sales engineers will be happy to assist you on your next project.